THT: Components with through-hole soldering have higher mechanical strength because they penetrate the PCB and are soldered on the other side
SMT: Surface mount technology allows for a more compact layout, reduces wire length
Product features:High density battery design, fully characterized by ultra-low Rds avalanche voltage and current
Product applications: Consumer electronics power supply, motor control, synchronous rectification, isolated DC
Product features: Surface mount packaging with low Rps (on) for operating ESD protection gates under low logic level gate drivers
